Senior NPI Packaging Engineer

Our international client is currently searching for a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from package concept and technology selection through design, validation, qualification, and manufacturing handover. Working closely with global internal teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging solutions will be required.
Key responsibilities
Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP)
Evaluate packaging technologies and drive supplier/manufacturing partner development
Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations
Improve packaging design processes, tools, and methodologies for efficient NPI delivery
Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation
Analyze assembly data and communicate technical findings
Maintain awareness of industry and academic developments in semiconductor packaging
Requirements
Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field
~6 years’ experience in semiconductor packaging/NPI development
Strong knowledge of semiconductor assembly processes and package technologies
Experience with supplier design rules and 3D CAD tools (e.g., AutoCAD)
Understanding of package thermal characterization
Ability to work with global cross-functional teams and external partners
Strong ownership, communication, and technical presentation skills
Fluent English communication skills
Preferred experience
3D multiphysics simulation tools (Cadence, ANSYS, or equivalent)
Package reliability/qualification testing (MSL, TC, HAST, HTS, JEDEC standards)
Structured problem-solving methods (8D, DOE)
Package layout tools such as Cadence Allegro X APD and Klayout
Please contact Rachel Anderson for further details.