Principal Packaging Engineer

My client is seeking a Principal Packaging Engineer to lead the design and development of cutting-edge advanced packaging technologies. 
What you’ll do:
Lead and architect innovative 3D/2.5D packaging solutions from concept to prototype
Oversee design, assembly, testing, and validation of advanced packaging demonstrators
Define technology roadmaps and guide multiple packaging projects.
Collaborate with internal and external teams to solve system-level integration challenges
Represent the company in technical forums, proposals, and collaborative bids
About you:
Proven experience in advanced semiconductor packaging - 3D/2.5D
Strong, extended knowledge of design, modelling, assembly, and validation processes
Skilled in signal/power integrity and thermal management
Excellent communication, leadership, and problem-solving skills
Track record of delivering demonstrators and leading cross-functional teams
Benefits include:
15% pension (10% employer)
Annual bonus
Private medical insurance extended to family
Visa sponsorship and offer up to £4000 relocation fees
If you're looking for a strategic, hands-on role aims to define and deliver next-generation packaging for  AI applications, contact Ella Flynn at IC Resources