About the role
My client is seeking a Principal Packaging Engineer to lead the design and development of cutting-edge advanced packaging technologies.
Lead and architect innovative 3D/2.5D packaging solutions from concept to prototype
Oversee design, assembly, testing, and validation of advanced packaging demonstrators
Define technology roadmaps and guide multiple packaging projects.
Proven experience in advanced semiconductor packaging - 3D/2.5D
Strong, extended knowledge of design, modelling, assembly, and validation processes
15% pension (10% employer)
~ Annual bonus
~ Private medical insurance extended to family
~ Visa sponsorship and financial relocation assistance
About this listing
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