About the role
Our leading Cambridge based semiconductor client is currently searching for a Senior Packaging Engineer to lead the development of advanced semiconductor packaging solutions for high-performance GaN power products. The role will involve driving package design, simulation, and qualification, working closely with internal teams and international partners to deliver differentiated, high-density solutions aligned with the product roadmap. This is a hands-on technical leadership role covering simulation, design, supplier collaboration, qualification, and product support — from concept through to high-volume manufacturing. xwzovoh
Apply now, read the job details by scrolling down Double check you have the necessary skills before sending an application.
Required skills for the Senior Semiconductor Packaging Engineer will include:
- Semiconductor packaging design experience
- 3D multiphysics simulation (COMSOL, ANSYS or similar)
- Semiconductor assembly knowledge (wirebond, flip-chip, embedded)
- Thermal characterisation and reliability testing experience (JEDEC, AEC-Q100)
- Strong communication experience
- Degree qualified
Please contact Rachel Anderson for further details.
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